Back grind tape
High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!
D&X Corporation offers "Back Grind Tape." We provide two types of protective tapes for the back grind process: a UV type that allows tape removal without stressing the wafer due to reduced adhesive strength from UV exposure, and a Non-UV type with low adhesion for gentle removal. We also accommodate specification changes and the development of new types based on your requests. We can handle prototypes starting from small quantities, so please contact us for inquiries. 【Features】 ■ High adhesion that prevents water ingress ■ No adhesive residue, preventing contamination of the substrate ■ High flatness for grinding processes ■ Conforms to uneven surfaces *For more details, please refer to the PDF document or feel free to contact us.
- Company：D&X
- Price：Other
